10M50DCF672I7G vs 10M40DCF672I7G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF672I7G disebabkan oleh Intel dan 10M40DCF672I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 10M50DCF672I7G 10M40DCF672I7G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX® 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K 9-Kbit blocks —
DSP Blocks (18x18 Multipliers) 144 —
User I/Os 500 —
Kemasan 672-ball FBGA (FineLine BGA), 1.0 mm pitch 672-ball FBGA (1.0 mm pitch)
Process Technology 55 nm —
Core Supply Voltage 1.2 V 1.2 V
Configuration Memory On-chip dual-configuration flash On-die flash (non-volatile, dual-image)
User Flash Memory (UFM) [DATA_NEEDED: UFM size in Kbits] —
PLLs 4 general-purpose 4
Global Clock Networks [DATA_NEEDED: global clock count] 16
Integrated ADC 12-bit SAR, 1 MSPS, up to 17 analog input channels —
Temperature Sensor On-die diode —
On-chip Voltage Regulators Yes (internal core regulation) —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
Speed Grade 7 —
Status RoHS Compliant —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL 3 (per JEDEC J-STD-020) 3
Configuration Interface JTAG, Active Serial (AS), Passive Serial (PS) —
Product Family — MAX 10
Logic Elements (LEs) — 40,000
Embedded Memory (M9K blocks) — 2,500 Kbits
Embedded User Flash — 1,290,240 bits
User I/O Count (max) — 500
Multipliers (18x18) — 144
Process Node — 55 nm
Gambaran Suhu Operasi — -40 C to +100 C (industrial)
Hard Memory Controller — DDR3 / LPDDR2 (integrated)
On-die ADC — Yes (1 MSPS, 12-bit equivalent)

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