A3P1000-1FGG256M vs A3P1000-2FG256M Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P1000-1FGG256M disebabkan oleh Microchip Technology dan A3P1000-2FG256M disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
A3P1000-1FGG256M A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip

A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip

A3P1000-1FGG256M ✓ Aktif
Microchip Technology
A3P1000-2FG256M A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip

A3P1000-2FG256M ✓ Aktif

Pengandingan Spesifikasi

Parametr A3P1000-1FGG256M A3P1000-2FG256M
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family ProASIC3 ProASIC3
System Gates 1000000 —
Logic Elements 11000 LE 11000 LE
User I/O 177 —
Embedded RAM 147456 bits —
I/O Banks 4 4 banks (banked VCCIB)
Core Supply Voltage 1.5 V —
Tegangan Pemberi Arus Operasi 1.5 V 1.5 V
Speed Grade -1 2
Configuration Memory Flash (nonvolatile, single chip) —
Programmability In-system reprogrammable Reprogrammable, non-volatile flash
Suhu Operasi 0C to +85C —
Kemasan 256-LBGA (FBGA-256) —
Gaya Pemasangan SMD/SMT SMD/SMT
Packaging Tray Tray
Product Series A3P1000 —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Number of Gates 1000000 —
Number of I/Os — 177 I/O
System Frequency — 310 MHz
Technology — 130 nm CMOS, flash-based
Kemasan / Case — FBGA-256 (256-LBGA)
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +85 C
Configuration — Single-chip, instant-on (no external config PROM)
Series — A3P1000

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