A3P1000-1FGG256M vs A3P1000-2FG256M Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P1000-1FGG256M sa pamamagitan ng Microchip Technology at A3P1000-2FG256M sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P1000-1FGG256M - ProASIC3 FPGA 1M Gate 256-LBGA | Microchip
A3P1000-1FGG256M ✓ NakahandaMicrochip Technology
A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FG256M ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P1000-1FGG256M | A3P1000-2FG256M |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 1000000 | — |
| Logic Elements | 11000 LE | 11000 LE |
| User I/O | 177 | — |
| Embedded RAM | 147456 bits | — |
| I/O Banks | 4 | 4 banks (banked VCCIB) |
| Core Supply Voltage | 1.5 V | — |
| Supply Voltage na Operasyon | 1.5 V | 1.5 V |
| Speed Grade | -1 | 2 |
| Configuration Memory | Flash (nonvolatile, single chip) | — |
| Programmability | In-system reprogrammable | Reprogrammable, non-volatile flash |
| Temperature na Operasyon | 0C to +85C | — |
| Packhaging | 256-LBGA (FBGA-256) | — |
| Style ng Pagpapasok | SMD/SMT | SMD/SMT |
| Packaging | Tray | Tray |
| Product Series | A3P1000 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Number of Gates | 1000000 | — |
| Number of I/Os | — | 177 I/O |
| System Frequency | — | 310 MHz |
| Technology | — | 130 nm CMOS, flash-based |
| Packhaging / Kaso | — | FBGA-256 (256-LBGA) |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +85 C |
| Configuration | — | Single-chip, instant-on (no external config PROM) |
| Series | — | A3P1000 |