A3P600-2FGG144 vs A3P1000-1FGG144T Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3P600-2FGG144 disebabkan oleh Microsemi dan A3P1000-1FGG144T disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
A3P1000-1FGG144T ✓ AktifPengandingan Spesifikasi
| Parametr | A3P600-2FGG144 | A3P1000-1FGG144T |
|---|---|---|
| Merek | Microsemi | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Kemasan | 144-Ball FBGA (FGG144) | — |
| Ball Pitch | 1 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40°C to +125°C |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Number of Logic Elements | — | 11K LEs |
| Number of Gates | — | 1000000 |
| Total RAM Bits | — | 147456 |
| Number of I/O | — | 97 |
| Tegangan Pemberi Arus | — | 1.425V to 1.575V |
| Kemasan / Case | — | 144-LBGA |
| Supplier Device Package | — | 144-FPBGA (13x13) |
| Grade | — | Automotive |
| Differential I/O Standards | — | LVPECL, LVDS, B-LVDS, M-LVDS |
| Number of CCC Blocks | — | 6 |
| Number of PLLs | — | 1 |