A3P600-2FGG144 vs A3P1000-1FGG144T Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-2FGG144 sa pamamagitan ng Microsemi at A3P1000-1FGG144T sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
A3P1000-1FGG144T ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-2FGG144 | A3P1000-1FGG144T |
|---|---|---|
| Brand | Microsemi | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Packhaging | 144-Ball FBGA (FGG144) | — |
| Ball Pitch | 1 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40°C to +125°C |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Number of Logic Elements | — | 11K LEs |
| Number of Gates | — | 1000000 |
| Total RAM Bits | — | 147456 |
| Number of I/O | — | 97 |
| Volte ng Pagbibigay | — | 1.425V to 1.575V |
| Packhaging / Kaso | — | 144-LBGA |
| Supplier Device Package | — | 144-FPBGA (13x13) |
| Grade | — | Automotive |
| Differential I/O Standards | — | LVPECL, LVDS, B-LVDS, M-LVDS |
| Number of CCC Blocks | — | 6 |
| Number of PLLs | — | 1 |