A3PE3000-2FGG324 vs A3PE3000-FG324 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000-2FGG324 disebabkan oleh Microchip Technology dan A3PE3000-FG324 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ AktifMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ AktifPengandingan Spesifikasi
| Parametr | A3PE3000-2FGG324 | A3PE3000-FG324 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | ProASIC3E | ProASIC3E Flash Family |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | 231 MHz |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) | — |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| Kemasan | 324-ball FBGA (FGG324) | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | 2 | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging Type | Tray | — |
| Status RoHS | Green (RoHS compliant) | RoHS Non-Compliant (contains lead, per digichip listing) |
| Automotive Qualification | Not qualified (standard grade) | — |
| Logic Elements / CLBs | — | 75,264 |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |