EP1C12F324C8 vs EP1C12F324C8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C12F324C8 disebabkan oleh Intel dan EP1C12F324C8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C12F324C8 | EP1C12F324C8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Kemasan | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | FBGA-324 |
| Core Voltage | 1.5 V | — |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | — |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | 8 |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |