EP1C12F324C8 vs EP1C12F324C8L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F324C8 sa pamamagitan ng Intel at EP1C12F324C8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C12F324C8 | EP1C12F324C8L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Packhaging | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | FBGA-324 |
| Core Voltage | 1.5 V | — |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | — |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | 8 |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |