EP1C4F324C7 vs EP1C4F324C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1C4F324C7 disebabkan oleh Intel dan EP1C4F324C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1C4F324C7 | EP1C4F324C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | Cyclone |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | 249 |
| Kemasan | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | — |
| Core Supply Voltage | 1.5 V | — |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Suhu Operasi | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial, C6 suffix) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| Status RoHS | Compliant (lead-free FBGA) | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 4,000 |
| Total RAM Bits | — | 78,336 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| PLLs | — | 2 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Maximum Internal Frequency | — | 405.2 MHz |
| Package Type | — | 324-ball FineLine BGA (FBGA) |
| Configuration Method | — | Serial / JTAG |