EP1M350F780C6 vs EP1M350F780C7ES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1M350F780C6 disebabkan oleh Intel dan EP1M350F780C7ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1M350F780C6 | EP1M350F780C7ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Mercury FPGA | — |
| Logic Family | CMOS | CMOS |
| Number of User I/Os | 486 | — |
| Total Pins / Balls | 780 | — |
| Kemasan | 780-FBGA (FineLine BGA), 29 mm x 29 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Core Supply Voltage | 1.8 V (1.71 V to 1.89 V) | — |
| Suhu Operasi | 0 C to 85 C (TJ, commercial grade) | 0 C to 85 C |
| Integrated Transceivers | Yes, up to 1.25 Gbps with CDR support | — |
| Logic Elements / LUTs | [DATA_NEEDED: logic element count] | — |
| On-chip Memory | [DATA_NEEDED: embedded memory size] | — |
| Status RoHS | Non-compliant (per one distributor listing) | unknown |
| Lead Free Status | [DATA_NEEDED: lead-free status] | — |
| Package Style | Bulk tray per distributor listings | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Programmable Logic Type | In-system programmable | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| Tegangan Pemberi Arus | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Tegangan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |