EP1M350F780C6 vs EP1M350F780C7ES 비교
다음의 상세 나란히 비교: EP1M350F780C6 제조: Intel 및 EP1M350F780C7ES 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP1M350F780C6 | EP1M350F780C7ES |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $905.00 | $0.00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Mercury FPGA | — |
| Logic Family | CMOS | CMOS |
| Number of User I/Os | 486 | — |
| Total Pins / Balls | 780 | — |
| 패키지 | 780-FBGA (FineLine BGA), 29 mm x 29 mm | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Core Supply Voltage | 1.8 V (1.71 V to 1.89 V) | — |
| 동작 온도 | 0 C to 85 C (TJ, commercial grade) | 0 C to 85 C |
| Integrated Transceivers | Yes, up to 1.25 Gbps with CDR support | — |
| Logic Elements / LUTs | [DATA_NEEDED: logic element count] | — |
| On-chip Memory | [DATA_NEEDED: embedded memory size] | — |
| RoHS 상태 | Non-compliant (per one distributor listing) | unknown |
| Lead Free Status | [DATA_NEEDED: lead-free status] | — |
| Package Style | Bulk tray per distributor listings | — |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Programmable Logic Type | In-system programmable | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| 공급 전압 | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| 열 저항 | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |