EP1S25F780C7 vs EP1S30F780C7AA Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1S25F780C7 disebabkan oleh Intel dan EP1S30F780C7AA disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1S30F780C7AA EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C7AA ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP1S25F780C7 EP1S30F780C7AA
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Family Stratix Stratix
Logic Elements 25,660 32,470
LABs / CLBs 2,566 LABs —
Total Memory Bits 1,944,576 bits 3,317,184
User I/Os 597 —
Kemasan 780-ball FC-FBGA (FineLine BGA) 780-ball FCBGA (FineLine BGA)
Package Dimensions 29 x 29 mm —
Ball Pitch 1 mm —
Process Technology 130 nm CMOS —
Core Voltage (VCCINT) 1.5 V —
Internal Performance up to 420.17 MHz —
Suhu Operasi 0C to +85C (Commercial) 0C to +85C (commercial)
Speed Grade 7 -7
Jenis Pemasangan Surface Mount (BGA) —
Aras MSL [DATA_NEEDED: MSL level] 3 (168 Hours)
Maximum User I/O — 597
Core Voltage — 1.5 V (VCCINT)
I/O Standards Supported — LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X
DSP Blocks — Embedded multiplier blocks (9x9, 18x18, 36x36)
DSP Performance — Up to 2.1 GMACS at -7 speed grade
PLLs — Multi-PLL architecture
Configuration Modes — Passive Serial, Fast Passive Parallel, JTAG
Process Node — 0.13 µm SRAM
Packaging — Tray

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