EP1S60F1020C6N vs EP1S60F1020C5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1S60F1020C6N disebabkan oleh Intel dan EP1S60F1020C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP1S60F1020C5 - 57K-Cell Stratix FPGA, 1020-BGA | Altera/Intel
EP1S60F1020C5 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP1S60F1020C6N | EP1S60F1020C5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Series | Stratix | Stratix |
| Family | Stratix (EP1S) | Stratix (EP1S) |
| Logic Elements (LEs) | 57,120 | — |
| Logic Cells | 6,570 blocks (per chipdig datasheet summary) | — |
| Embedded RAM (Total Bits) | 5,215,104 bits | — |
| Embedded Multipliers | 773 (18x18) | — |
| Maximum User I/O Pins | Per datasheet, package-dependent (F1020 variant) | — |
| Package Type | 1020-ball FBGA (FineLine BGA), 33 x 33 mm, 1 mm pitch | FBGA-1020 (FineLine BGA) |
| Logic Family / Process | CMOS, 0.13 µm | — |
| Suhu Operasi | 0°C to +85°C (Commercial) | 0 C to 85 C (Commercial) |
| Tegangan Pemberi Arus | Per datasheet (Stratix Device Handbook Vol. 1) | — |
| Speed Grade | C6 (mid-tier) | C5 |
| Lead-Free / Pb-Free | Yes (suffix 'N') | — |
| Status RoHS | Compliant (per 'N' suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration | JTAG / Passive Serial / Fast Passive Parallel via MSEL pins | — |
| PLL Count | 12 (per Stratix family datasheet) | — |
| Memory Block Types | TriMatrix (M512, M4K, M-RAM) | — |
| Logic Elements | — | 57,120 |
| Configurable Logic Blocks (CLBs) | — | 6,570 |
| Total RAM Bits | — | 5,215,104 (5.2 Mbit) |
| User I/O Pins | — | 773 |
| Number of PLLs | — | 12 |
| Core Voltage | — | 1.5 V |
| I/O Voltage Tolerance | — | 3.3 V (multi-standard) |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.13 µm CMOS, 1.5 V core |