EP1SGX10DF672C5N vs EP1SGX10DF672I6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX10DF672C5N disebabkan oleh Intel dan EP1SGX10DF672I6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP1SGX10DF672C5N EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

EP1SGX10DF672C5N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP1SGX10DF672C5N EP1SGX10DF672I6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Family Stratix GX Stratix GX
Logic Cells 10,570 —
Logic Array Blocks (LABs) 1,057 —
Configurable Logic Blocks 1,200 —
User I/Os 362 —
On-chip RAM 920,448 bits —
Supply Voltage (Core, VCCINT) 1.5 V nominal (1.425 V to 1.575 V) —
Technology 130 nm CMOS —
Suhu Operasi 0 C to 85 C (Commercial) 0 C to +85 C (commercial)
Kemasan 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch 672-ball FC-FBGA (DF672)
Jenis Pemasangan Surface Mount (Flip-Chip BGA) Surface Mount
Logic Family CMOS —
Configuration Passive Serial / Passive Parallel / JTAG / Altera Serial —
Status RoHS Compliant (FBGA package) [DATA_NEEDED: RoHS Status]
High-Speed Transceivers Embedded GX transceivers (data rate not specified in provided data [DATA_NEEDED: transceiver count and max data rate]) —
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
Core Supply Voltage — 1.5 V
Package Body Size — 33 x 33 mm, 1.0 mm pitch
Aras MSL — [DATA_NEEDED: MSL Level]

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