EP1SGX10DF672C5N vs EP1SGX10DF672I6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX10DF672C5N sa pamamagitan ng Intel at EP1SGX10DF672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP1SGX10DF672C5N EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

EP1SGX10DF672C5N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP1SGX10DF672C5N EP1SGX10DF672I6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family Stratix GX Stratix GX
Logic Cells 10,570 —
Logic Array Blocks (LABs) 1,057 —
Configurable Logic Blocks 1,200 —
User I/Os 362 —
On-chip RAM 920,448 bits —
Supply Voltage (Core, VCCINT) 1.5 V nominal (1.425 V to 1.575 V) —
Technology 130 nm CMOS —
Temperature na Operasyon 0 C to 85 C (Commercial) 0 C to +85 C (commercial)
Packhaging 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch 672-ball FC-FBGA (DF672)
Uri ng Pagpapasok Surface Mount (Flip-Chip BGA) Surface Mount
Logic Family CMOS —
Configuration Passive Serial / Passive Parallel / JTAG / Altera Serial —
Tindminan RoHS Compliant (FBGA package) [DATA_NEEDED: RoHS Status]
High-Speed Transceivers Embedded GX transceivers (data rate not specified in provided data [DATA_NEEDED: transceiver count and max data rate]) —
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
Core Supply Voltage — 1.5 V
Package Body Size — 33 x 33 mm, 1.0 mm pitch
Level ng MSL — [DATA_NEEDED: MSL Level]

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