EP2A25F672I-9 vs EP2A25F672I6 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672I-9 disebabkan oleh Intel dan EP2A25F672I6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2A25F672I-9 EP2A25F672I6
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family APEX II APEX II
Logic Elements (typical) 25,000 —
Maximum System Gates [DATA_NEEDED: maximum system gates] —
Embedded System Blocks (ESB) Memory 1,125 Kbits —
Maximum User I/O Pins [DATA_NEEDED: maximum user I/O pins] —
Number of PLLs 4 —
Process Technology 0.18 µm CMOS 0.18 µm CMOS
Core Voltage 1.5 V / 1.8 V (speed-grade dependent) 1.5 V
Operating Temperature Grade Industrial (-40 °C to +100 °C junction) —
Speed Grade -9 6
Kemasan 672-pin FCBGA (FineLine BGA) 672-ball FineLine BGA (FBGA-672)
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Tingkat sensitiviti Air Nama (MSL) 3 (per Vyrian listing) —
Peak Reflow Temperature 220 °C (per Vyrian listing) —
Configuration Method JTAG / serial configuration EPROM External SRAM configuration device (EPC series)
Supported I/O Standards LVTTL, LVCMOS, LVDS, PCI —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Legacy Status Obsolete - consult Altera / Intel FPGA archive for documentation —
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Embedded Memory — Embedded System Blocks (ESB), dual-port RAM / CAM
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
Aras MSL — [DATA_NEEDED: moisture sensitivity level]

Laporan Datasheet & Sumber

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