EP2A40B724C7 vs EP2A40B724C9 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40B724C7 disebabkan oleh Intel dan EP2A40B724C9 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2A40B724C7 EP2A40B724C9
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Family APEX II —
Logic Elements / Cells 38,400 —
Total System Gates 1,500,000 —
Embedded RAM Bits 655,360 655,360 (approximately 655 Kbits / 80 Kbytes)
Maximum User I/O 540 —
Core Supply Voltage 1.425 V to 1.575 V (typ. 1.5 V) —
Process Technology 0.15 µm CMOS, up to 8 metal layers, all-layer copper —
Maximum Internal Frequency 562 MHz —
PLLs 4 —
Kemasan 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm —
Suhu Operasi 0 °C to +85 °C (commercial) 0C to +85C
I/O Standards Supported LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) —
Configuration Method JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices —
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V 1.5 V, 1.8 V, 2.5 V, 3.3 V
DDR Memory Support Yes (via ESB / I/O circuitry) —
Status RoHS Non-compliant (lead-bearing FCBGA) [DATA_NEEDED: RoHS status]
Aras MSL [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Series — APEX II
Logic Elements (LE) — 38,400
Number of User I/O — 540
Tegangan Pemberi Arus Operasi — 1.425 V to 1.575 V (core)
Kemasan / Case — 724-BBGA, FCBGA (Flip-Chip BGA)
Supplier Device Package — 724-BGA (35x35 mm)
Shipping Medium — Tray
Lead-Free — [DATA_NEEDED: lead-free status]
Architecture — LUT-based with embedded memory blocks
Typical Core Power — [DATA_NEEDED: ICCDAT typical]

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