EP2A40B724C7 vs EP2A40B724C9 比較

詳細並排比較 EP2A40B724C7 由 Intel 與 EP2A40B724C9 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2A40B724C7 EP2A40B724C9
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family APEX II —
Logic Elements / Cells 38,400 —
Total System Gates 1,500,000 —
Embedded RAM Bits 655,360 655,360 (approximately 655 Kbits / 80 Kbytes)
Maximum User I/O 540 —
Core Supply Voltage 1.425 V to 1.575 V (typ. 1.5 V) —
Process Technology 0.15 µm CMOS, up to 8 metal layers, all-layer copper —
Maximum Internal Frequency 562 MHz —
PLLs 4 —
封裝 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm —
工作溫度 0 °C to +85 °C (commercial) 0C to +85C
I/O Standards Supported LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) —
Configuration Method JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices —
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V 1.5 V, 1.8 V, 2.5 V, 3.3 V
DDR Memory Support Yes (via ESB / I/O circuitry) —
RoHS 狀態 Non-compliant (lead-bearing FCBGA) [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
安裝類型 Surface Mount (BGA) Surface Mount
Series — APEX II
Logic Elements (LE) — 38,400
Number of User I/O — 540
工作電源電壓 — 1.425 V to 1.575 V (core)
封裝 / 外殼 — 724-BBGA, FCBGA (Flip-Chip BGA)
Supplier Device Package — 724-BGA (35x35 mm)
Shipping Medium — Tray
Lead-Free — [DATA_NEEDED: lead-free status]
Architecture — LUT-based with embedded memory blocks
Typical Core Power — [DATA_NEEDED: ICCDAT typical]

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