EP2A70F1508C9 vs EP2A70F1508C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A70F1508C9 disebabkan oleh Intel dan EP2A70F1508C7N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2A70F1508C9 EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera

EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera

EP2A70F1508C9 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2A70F1508C9 EP2A70F1508C7N
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Series APEX II APEX II
Family APEX II FPGA —
Manufacturer Intel (formerly Altera) —
Logic Elements / Cells 67,200 —
Total RAM Bits 1,146,880 —
Number of I/O 1,060 —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: number of LABs] —
Number of PLLs 4 —
Number of Gates [DATA_NEEDED: typical gate count] —
Voltage - Supply (Core) 1.425 V to 1.575 V —
Jenis Pemasangan Surface Mount Surface mount
Kemasan / Case 1508-BBGA, FCBGA —
Supplier Device Package 1508-FBGA (40 × 40 mm) —
Suhu Operasi 0 °C to 85 °C 0°C to 85°C
Speed Grade C9 —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers —
High-Speed I/O Standards True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport —
Configuration Modes Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel —
Embedded Multiplier Blocks Yes —
Embedded Memory Type Dual-port RAM (ESB) / ROM / FIFO —
Status RoHS [DATA_NEEDED: RoHS status] unknown
Aras MSL [DATA_NEEDED: MSL level] —
Device Type — Field Programmable Gate Array (FPGA)
Technology — 0.15 µm CMOS
Core Voltage — 1.5 V
Logic Cells — 67,200 cells
Logic Array Blocks — 6,720 LABs
Total RAM — 1,146,880 bits
Programmable I/O — 1,060 I/O pins
Maximum Stated Frequency — 420 MHz
Gate Capacity — 3 million gates
Kemasan — 1508-pin FC-FBGA
REACH Status — unknown
AEC-Q100 Qualification — unknown
Configuration Method — [DATA_NEEDED: configuration method]
Package Dimensions — [DATA_NEEDED: package dimensions]
Tegangan Panas — [DATA_NEEDED: thermal resistance]
Arus Pemberi Arus — [DATA_NEEDED: supply current]

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