EP2AGX65DF29C6G vs EP2AGX65DF29C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX65DF29C6G disebabkan oleh Intel dan EP2AGX65DF29C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX65DF29C6G | EP2AGX65DF29C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | 40 nm |
| Kemasan | 780-pin FC-FBGA | 780-ball FC-FBGA (29x29 mm) |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount (flip-chip BGA) |
| Gambaran Suhu Operasi | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | 6 (C6) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 60,214 |
| Logic Array Blocks (LABs) | — | 2,530 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 5,371,904 |
| Maximum User I/O | — | 364 |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | 8 (up to 3.75 Gbps per Arria II GX family spec) |
| PLLs | — | 4 |
| Suhu Operasi | — | Commercial (0C to +85C) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |