EP2AGX95DF25C6G vs EP2AGX125DF25I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX95DF25C6G disebabkan oleh Intel dan EP2AGX125DF25I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2AGX95DF25C6G | EP2AGX125DF25I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Arria II GX | — |
| Logic Elements (LE) | 89,178 | — |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) | — |
| Embedded Memory Bits | 6,839,296 bits | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| DSP Blocks | Variable-precision (estimated 88 to 176) | 18x18 multipliers |
| User I/O | 260 | — |
| Transceivers | Up to 12 channels | Up to 12 (3.75 Gbps per channel) |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) | — |
| PLL | Up to 8 (per family datasheet) | — |
| Process Node | 40 nm | — |
| Kemasan | 572-ball FCBGA, 25x25 mm | 572-BGA, FCBGA (Flip-Chip FineLine BGA) |
| Speed Grade | -6 (fastest commercial) | — |
| Suhu Operasi | 0C to 85C (commercial, junction) | -40C to +100C (Industrial) |
| Configuration Modes | AS, AP, FPP, PS, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Series | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory | — | 8,315,904 bits |
| Number of I/O | — | 260 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Jenis Pemasangan | — | Surface Mount |
| Tegangan Pemberi Arus | — | 0.9 V core |
| Aras MSL | — | [DATA_NEEDED: MSL Level] |