EP2AGZ300FF35C3N vs EP2AGZ300FF35I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FF35C3N disebabkan oleh Intel dan EP2AGZ300FF35I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FF35C3N | EP2AGZ300FF35I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | — |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | 12.5 Gbps integrated |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| PLLs | 8 | — |
| Kemasan | 1152-ball FCBGA (FF35) | 1152-ball FC-FBGA (FF35) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Commercial | — |
| Logic Elements | — | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| Embedded Memory | — | M20K blocks (distributed) |
| DSP Blocks | — | Hard DSP columns (variable precision) |
| PCIe Support | — | PCIe Gen2 hard IP |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |