EP2AGZ300FF35C3N vs EP2AGZ300FF35I4 比較
詳細並排比較 EP2AGZ300FF35C3N 由 Intel 與 EP2AGZ300FF35I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGZ300FF35C3N | EP2AGZ300FF35I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | — |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | 12.5 Gbps integrated |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| PLLs | 8 | — |
| 封裝 | 1152-ball FCBGA (FF35) | 1152-ball FC-FBGA (FF35) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Commercial | — |
| Logic Elements | — | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| Embedded Memory | — | M20K blocks (distributed) |
| DSP Blocks | — | Hard DSP columns (variable precision) |
| PCIe Support | — | PCIe Gen2 hard IP |
| RoHS 狀態 | — | Compliant |
| Lead-Free | — | Yes |