EP2AGZ300FF35C3N vs EP2AGZ300FF35I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35C3N sa pamamagitan ng Intel at EP2AGZ300FF35I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35C3N | EP2AGZ300FF35I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory (Bits) | 18,854,912 | — |
| User I/Os | 554 | — |
| Maximum User I/O Pins (Package) | 1,152 | — |
| 18x18 Multipliers | 554 | — |
| Transceivers | Up to 16 channels | 12.5 Gbps integrated |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| PLLs | 8 | — |
| Packhaging | 1152-ball FCBGA (FF35) | 1152-ball FC-FBGA (FF35) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Commercial | — |
| Logic Elements | — | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | — | 11,920 |
| Maximum User I/O | — | 554 |
| Operating Frequency (Max) | — | 500 MHz |
| Temperature Grade | — | Industrial (-40 C to +100 C) |
| Number of Pins/Balls | — | 1152 |
| Terminal Form | — | Ball (BGA) |
| Embedded Memory | — | M20K blocks (distributed) |
| DSP Blocks | — | Hard DSP columns (variable precision) |
| PCIe Support | — | PCIe Gen2 hard IP |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |