EP2AGZ300FF35I4 vs EP2AGZ300FF35I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FF35I4 disebabkan oleh Intel dan EP2AGZ300FF35I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FF35I4 | EP2AGZ300FF35I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | — |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Kemasan | 1152-ball FC-FBGA (FF35) | 1152-ball FBGA (FF35) |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | — |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | [DATA_NEEDED: number of DSP blocks] |
| PCIe Support | PCIe Gen2 hard IP | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 300000 |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Node | — | 40 nm |
| Suhu Operasi | — | -40C to +100 C (I3 industrial) |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| Aras MSL | — | 3 (168 hours) |