EP2AGZ300HF40C3G vs EP2AGZ300HF40I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300HF40C3G disebabkan oleh Intel dan EP2AGZ300HF40I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300HF40C3G | EP2AGZ300HF40I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| Kemasan | 1517-ball FBGA | FBGA-1517 (HF40), 45 mm body, 1 mm pitch |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Suhu Operasi | Commercial (0C to +85C) | -40C to +100C (industrial) |
| Embedded Memory | Approx. 18.7 Mbits | 20.475 Mbits |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| Status RoHS | Pb-free finish - compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 300,000 (approx.) |
| Embedded Multipliers | — | 28 (18x18) |
| User I/O Pins | — | 734 |
| Transceiver Count | — | 24 |
| Transceiver Data Rate | — | up to 6.375 Gbps |
| Core Voltage | — | 1.2 V (typical) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Aras MSL | — | 3 |