EP2AGZ300HF40C3G vs EP2AGZ300HF40I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300HF40C3G sa pamamagitan ng Intel at EP2AGZ300HF40I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300HF40C3G | EP2AGZ300HF40I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 300,000 | — |
| User I/O Count | 734 | — |
| Packhaging | 1517-ball FBGA | FBGA-1517 (HF40), 45 mm body, 1 mm pitch |
| Speed Grade | C3 (commercial) | — |
| Lead Finish | Pb-free (G suffix) | — |
| Temperature na Operasyon | Commercial (0C to +85C) | -40C to +100C (industrial) |
| Embedded Memory | Approx. 18.7 Mbits | 20.475 Mbits |
| DSP Blocks | 800+ (18x18 multipliers) | — |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | — |
| PLLs | 8 | — |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | — |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | — |
| Tindminan RoHS | Pb-free finish - compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 300,000 (approx.) |
| Embedded Multipliers | — | 28 (18x18) |
| User I/O Pins | — | 734 |
| Transceiver Count | — | 24 |
| Transceiver Data Rate | — | up to 6.375 Gbps |
| Core Voltage | — | 1.2 V (typical) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Level ng MSL | — | 3 |