EP2AGZ300HF40C3N vs EP2AGZ350HF40C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300HF40C3N disebabkan oleh Intel dan EP2AGZ350HF40C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2AGZ300HF40C3N EP2AGZ350HF40C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Aktif
Family Arria II GZ Arria II GZ
Logic Elements 298,000 348,500
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] [DATA_NEEDED: ALM count]
Logic Array Blocks (LABs) 11,920 13,940
Total Memory Bits 18,854,912 bits (~18.85 Mbit) —
Embedded Multipliers (18x18) 736 —
Maximum User I/O 734 —
Transceivers Up to 12 channels Up to 24 (per family datasheet)
Transceiver Data Rate Up to 6.375 Gbps Up to 6.553 Gbps
Process Technology 40 nm 40 nm low-power
Core Voltage 0.9 V 0.9 V
Suhu Operasi 0C to +85C (Commercial) —
Kemasan 1517-BBGA, FCBGA (Flip-Chip BGA) 1517-ball FCBGA (HF40)
Memory Interface Support DDR3-800, DDR2, QDR II+, RLDRAM II —
PCIe Hard IP PCI Express Gen1 / Gen2 —
PLL Type Fractional PLL + Multiplier PLL —
Status RoHS Compliant —
Status Lingkungan Hidup Obsolete (NRND/EOL per Intel) —
Configuration Interface JTAG, Passive Serial, Fast Passive Parallel —
Design Software Quartus II (legacy) —
Embedded Memory Bits — 21,270,528
Embedded Memory Blocks (M9K) — [DATA_NEEDED: M9K count]
User I/Os — 734
DSP Blocks — [DATA_NEEDED: DSP block count]
Operating Temperature Grade — Commercial (C3)
Configuration Mode — FPP / AS / JTAG
Jenis Pemasangan — Surface Mount (flip-chip BGA)

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