EP2AGZ300HF40C3N vs EP2AGZ350HF40C3N 比較

詳細並排比較 EP2AGZ300HF40C3N 由 Intel 與 EP2AGZ350HF40C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2AGZ300HF40C3N EP2AGZ350HF40C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Family Arria II GZ Arria II GZ
Logic Elements 298,000 348,500
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] [DATA_NEEDED: ALM count]
Logic Array Blocks (LABs) 11,920 13,940
Total Memory Bits 18,854,912 bits (~18.85 Mbit) —
Embedded Multipliers (18x18) 736 —
Maximum User I/O 734 —
Transceivers Up to 12 channels Up to 24 (per family datasheet)
Transceiver Data Rate Up to 6.375 Gbps Up to 6.553 Gbps
Process Technology 40 nm 40 nm low-power
Core Voltage 0.9 V 0.9 V
工作溫度 0C to +85C (Commercial) —
封裝 1517-BBGA, FCBGA (Flip-Chip BGA) 1517-ball FCBGA (HF40)
Memory Interface Support DDR3-800, DDR2, QDR II+, RLDRAM II —
PCIe Hard IP PCI Express Gen1 / Gen2 —
PLL Type Fractional PLL + Multiplier PLL —
RoHS 狀態 Compliant —
生命週期狀態 Obsolete (NRND/EOL per Intel) —
Configuration Interface JTAG, Passive Serial, Fast Passive Parallel —
Design Software Quartus II (legacy) —
Embedded Memory Bits — 21,270,528
Embedded Memory Blocks (M9K) — [DATA_NEEDED: M9K count]
User I/Os — 734
DSP Blocks — [DATA_NEEDED: DSP block count]
Operating Temperature Grade — Commercial (C3)
Configuration Mode — FPP / AS / JTAG
安裝類型 — Surface Mount (flip-chip BGA)

資料表與資源

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