EP2C70F672C7N vs EP2C70F896C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C70F672C7N disebabkan oleh Intel dan EP2C70F896C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2C70F896C6 - 68K LE Cyclone II FPGA, 896-FBGA | Intel
EP2C70F896C6 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2C70F672C7N | EP2C70F896C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | 1,152,000 |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 622 (per DigiKey listing) |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Kemasan | 672-BGA (FBGA-672) | 896-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Speed Grade | C7 (slower, lower-power variant) | 6 |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant (lead-free FBGA) | [DATA_NEEDED: confirmed RoHS compliance status] |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Logic Elements | — | 68,416 |
| M9K Memory Blocks | — | 622 |
| Embedded 18x18 Multipliers | — | 150 |
| Maximum Operating Frequency | — | 500 MHz |
| Core Voltage | — | 1.2 V |
| Configuration Modes | — | Active Serial, Passive Serial, JTAG |
| Operating Temperature Grade | — | Commercial (0C to +85C) inferred from speed grade suffix |