EP2S180F1020C3 vs EP2S130F1020C3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1020C3 disebabkan oleh Intel dan EP2S130F1020C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2S180F1020C3 EP2S130F1020C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series Stratix II Stratix II
Device Family EP2S180 —
Equivalent Logic Elements (LEs) 179,400 —
Logic Array Blocks (LABs) 8,970 6,627
Embedded Memory (RAM bits) 9,383,040 —
Maximum User I/Os 742 —
Kemasan 1020-ball FBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount Surface Mount
Process Node 90 nm, all-layer copper SRAM —
Core Voltage 1.2 V —
Speed Grade C3 C3 (commercial, -3 speed)
Suhu Operasi Commercial (0C to +85C) 0C to +85C (commercial, 'C' speed grade)
DSP Blocks Dedicated high-speed multipliers —
Memory Interfaces Supported DDR2 SDRAM, QDRII SRAM, RLDRAM II —
I/O Standards LVDS, LVPECL, SSTL, HSTL —
Configuration Method SRAM-based (volatile, requires boot device) —
Development Toolchain Quartus II / Quartus Prime —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Family — Stratix II
Logic Elements / Cells — 132,540
User I/Os — 742
Embedded Memory (TriMatrix) — [DATA_NEEDED: total Mbits]
DSP / Multiplier Blocks — [DATA_NEEDED: DSP block count]
Transceivers — Logic-rich SKU (no transceiver; transceiver variants use different suffix)
Maximum Internal Frequency — 778.82 MHz (per family datasheet)
Process Technology — 90 nm
Core Supply Voltage (VCCINT) — 1.15 V to 1.25 V
Kemasan / Case — 1020-BBGA (FC-FBGA), 33x33 mm
Supplier Device Package — 1020-FBGA (33x33)
Aras MSL — [DATA_NEEDED: MSL level]

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