EP2S180F1020C3 vs EP2S130F1020C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S180F1020C3 sa pamamagitan ng Intel at EP2S130F1020C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S180F1020C3 | EP2S130F1020C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Stratix II | Stratix II |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Packhaging | 1020-ball FBGA (flip-chip BGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C3 | C3 (commercial, -3 speed) |
| Temperature na Operasyon | Commercial (0C to +85C) | 0C to +85C (commercial, 'C' speed grade) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II |
| Logic Elements / Cells | — | 132,540 |
| User I/Os | — | 742 |
| Embedded Memory (TriMatrix) | — | [DATA_NEEDED: total Mbits] |
| DSP / Multiplier Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | Logic-rich SKU (no transceiver; transceiver variants use different suffix) |
| Maximum Internal Frequency | — | 778.82 MHz (per family datasheet) |
| Process Technology | — | 90 nm |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Packhaging / Kaso | — | 1020-BBGA (FC-FBGA), 33x33 mm |
| Supplier Device Package | — | 1020-FBGA (33x33) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |