EP2S180F1020C3 vs EP2S130F1020C3 比較
詳細並排比較 EP2S180F1020C3 由 Intel 與 EP2S130F1020C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2S180F1020C3 | EP2S130F1020C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Series | Stratix II | Stratix II |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| 封裝 | 1020-ball FBGA (flip-chip BGA) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C3 | C3 (commercial, -3 speed) |
| 工作溫度 | Commercial (0C to +85C) | 0C to +85C (commercial, 'C' speed grade) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II |
| Logic Elements / Cells | — | 132,540 |
| User I/Os | — | 742 |
| Embedded Memory (TriMatrix) | — | [DATA_NEEDED: total Mbits] |
| DSP / Multiplier Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | Logic-rich SKU (no transceiver; transceiver variants use different suffix) |
| Maximum Internal Frequency | — | 778.82 MHz (per family datasheet) |
| Process Technology | — | 90 nm |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| 封裝 / 外殼 | — | 1020-BBGA (FC-FBGA), 33x33 mm |
| Supplier Device Package | — | 1020-FBGA (33x33) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |