EP2S180F1508C3NAA vs EP2S180F1508C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1508C3NAA disebabkan oleh Intel dan EP2S180F1508C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
EP2S180F1508C3NAA ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2S180F1508C3NAA | EP2S180F1508C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix II | — |
| Logic Elements | 179,400 LEs | — |
| Adaptive Logic Modules (ALMs) | 71,760 ALMs | — |
| Embedded RAM (total) | 9,383,040 bits (M4K + M-RAM) | — |
| M4K RAM Blocks | 930 blocks of 4 Kbits each | — |
| M-RAM Blocks | 9 blocks of 512 Kbits each | — |
| DSP Blocks | 96 blocks (18x18 multipliers) | — |
| 18x18 Embedded Multipliers | 384 | — |
| Transceivers | 12 channels | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Maximum User I/O | 1170 user I/O pins | — |
| Kemasan | 1508-ball FCBGA | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | -3 (commercial, faster) | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| Core Voltage | [DATA_NEEDED: VCCINT nominal] | — |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Stratix II |
| Logic Elements/Cells | — | 179,400 cells |
| Total RAM Bits | — | 9,383,040 bits |
| Number of I/O | — | 1,170 I/O |
| Tegangan Pemberi Arus | — | 1.15 V to 1.25 V |
| Operating Frequency | — | 711.24 MHz |
| Supplier Device Package | — | 1508-FBGA (40 mm x 40 mm) |
| Kemasan / Case | — | 1508-BBGA, FCBGA |
| Terminal Count | — | 1,508 terminals |
| Terminal Form | — | Ball |
| Packaging | — | Tray |
| Time@Peak Reflow Temperature-Max | — | 30 s |
| Moisture Sensitivity Level | — | MSL 4 (72 hours) |
| Package Shape | — | Square |
| Configuration Technology | — | SRAM-based FPGA |