EP2S30F484C3 vs EP2S30F484I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S30F484C3 disebabkan oleh Intel dan EP2S30F484I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2S30F484C3 | EP2S30F484I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | — |
| Total RAM Bits | 1,369,728 | — |
| Number of User I/O | 342 | — |
| Number of I/O Pins (Package) | 500 | — |
| Core Voltage | 1.20 V | 1.2 V (refer to datasheet) |
| Operating Temperature (Max) | 85 C (Commercial) | — |
| Speed Grade | C3 | 4 |
| Kemasan | 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO) | — |
| Embedded DSP Blocks | Yes | — |
| PLL Count | Multiple (per family datasheet) | — |
| Status RoHS | [DATA_NEEDED: rohs status] | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| PLLs | — | Yes (on-chip, refer to datasheet for count) |
| Configuration Method | — | Serial/parallel via Quartus II |