EP2S30F484C3 vs EP2S30F484I4N 比較
詳細並排比較 EP2S30F484C3 由 Intel 與 EP2S30F484I4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2S30F484C3 | EP2S30F484I4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | — |
| Total RAM Bits | 1,369,728 | — |
| Number of User I/O | 342 | — |
| Number of I/O Pins (Package) | 500 | — |
| Core Voltage | 1.20 V | 1.2 V (refer to datasheet) |
| Operating Temperature (Max) | 85 C (Commercial) | — |
| Speed Grade | C3 | 4 |
| 封裝 | 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO) | — |
| Embedded DSP Blocks | Yes | — |
| PLL Count | Multiple (per family datasheet) | — |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| PLLs | — | Yes (on-chip, refer to datasheet for count) |
| Configuration Method | — | Serial/parallel via Quartus II |