EP2S30F484C3 vs EP2S30F484I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S30F484C3 sa pamamagitan ng Intel at EP2S30F484I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S30F484C3 | EP2S30F484I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | — |
| Total RAM Bits | 1,369,728 | — |
| Number of User I/O | 342 | — |
| Number of I/O Pins (Package) | 500 | — |
| Core Voltage | 1.20 V | 1.2 V (refer to datasheet) |
| Operating Temperature (Max) | 85 C (Commercial) | — |
| Speed Grade | C3 | 4 |
| Packhaging | 484-BBGA, FCBGA, 23 x 23 mm, 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | 90 nm |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO) | — |
| Embedded DSP Blocks | Yes | — |
| PLL Count | Multiple (per family datasheet) | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | — |
| Embedded Memory | — | 1,369,728 bits |
| User I/O Pins | — | 342 |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial -40C to +100C |
| Lead-Free / RoHS | — | Yes (N suffix indicates lead-free RoHS) |
| On-Chip DSP Blocks | — | Yes (dedicated 9x9/18x18/36x36 multipliers) |
| PLLs | — | Yes (on-chip, refer to datasheet for count) |
| Configuration Method | — | Serial/parallel via Quartus II |