EP2SGX130GF1508C4 vs EP2S180F1508C4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX130GF1508C4 disebabkan oleh Intel dan EP2S180F1508C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2SGX130GF1508C4 EP2S180F1508C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Aktif
Series Stratix II GX Stratix II
Logic Elements 132,540 —
Embedded Memory (Bits) 6,748,160 —
Logic Array Blocks (LABs) 6,627 —
Maximum User I/O 734 —
Internal Operating Frequency 717 MHz —
Number of PLLs 4 —
18 x 18 Multipliers 6,744 (approx, family feature) —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.15 V to 1.25 V (1.2 V nominal) —
Package Type 1508-Ball FC-FBGA —
Package Dimensions 40 mm x 40 mm —
Ball Pitch 1.0 mm —
Jenis Pemasangan Surface Mount —
Suhu Hubungan Operasi 0 C to 85 C (commercial grade) —
Logic Family CMOS —
Transceivers Embedded multi-gigabit transceivers (Stratix II GX feature) —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Product Type — Field Programmable Gate Array (FPGA)
Logic Elements/Cells — 179,400 cells
Total RAM Bits — 9,383,040 bits
Number of I/O — 1,170 I/O
Tegangan Pemberi Arus — 1.15 V to 1.25 V
Operating Frequency — 711.24 MHz
Supplier Device Package — 1508-FBGA (40 mm x 40 mm)
Kemasan / Case — 1508-BBGA, FCBGA
Terminal Count — 1,508 terminals
Terminal Form — Ball
Packaging — Tray
Time@Peak Reflow Temperature-Max — 30 s
Moisture Sensitivity Level — MSL 4 (72 hours)
Package Shape — Square
Configuration Technology — SRAM-based FPGA
Suhu Operasi — [DATA_NEEDED: operating temperature range]

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