EP2SGX130GF1508C4 vs EP2S180F1508C4 比較

詳細並排比較 EP2SGX130GF1508C4 由 Intel 與 EP2S180F1508C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2S180F1508C4 EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel

EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel

EP2S180F1508C4 ✓ 啟用中

規格比較

參數 EP2SGX130GF1508C4 EP2S180F1508C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Series Stratix II GX Stratix II
Logic Elements 132,540 —
Embedded Memory (Bits) 6,748,160 —
Logic Array Blocks (LABs) 6,627 —
Maximum User I/O 734 —
Internal Operating Frequency 717 MHz —
Number of PLLs 4 —
18 x 18 Multipliers 6,744 (approx, family feature) —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.15 V to 1.25 V (1.2 V nominal) —
Package Type 1508-Ball FC-FBGA —
Package Dimensions 40 mm x 40 mm —
Ball Pitch 1.0 mm —
安裝類型 Surface Mount —
工作接面溫度 0 C to 85 C (commercial grade) —
Logic Family CMOS —
Transceivers Embedded multi-gigabit transceivers (Stratix II GX feature) —
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Product Type — Field Programmable Gate Array (FPGA)
Logic Elements/Cells — 179,400 cells
Total RAM Bits — 9,383,040 bits
Number of I/O — 1,170 I/O
供應電壓 — 1.15 V to 1.25 V
Operating Frequency — 711.24 MHz
Supplier Device Package — 1508-FBGA (40 mm x 40 mm)
封裝 / 外殼 — 1508-BBGA, FCBGA
Terminal Count — 1,508 terminals
Terminal Form — Ball
Packaging — Tray
Time@Peak Reflow Temperature-Max — 30 s
Moisture Sensitivity Level — MSL 4 (72 hours)
Package Shape — Square
Configuration Technology — SRAM-based FPGA
工作溫度 — [DATA_NEEDED: operating temperature range]

資料表與資源

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