EP2SGX30CF780C3 vs EP2SGX30CF780C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30CF780C3 disebabkan oleh Intel dan EP2SGX30CF780C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX30CF780C3 | EP2SGX30CF780C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Logic Array Blocks (LABs) | 1,694 | — |
| Embedded RAM Bits | 1,369,728 | — |
| User I/Os | 361 | — |
| Kemasan | 780-ball FineLine BGA | 780-BBGA (flip-chip) |
| Process Node | 90 nm | — |
| Speed Grade | -3 | — |
| Suhu Operasi | 0C to +85C (commercial) | — |
| Transceivers | Embedded (GX family, up to 3.125 Gbps per channel) | Yes (Stratix II GX integrated) |
| Memory Interfaces | DDR / DDR2 / QDRII PHY | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Boson Bebas | [DATA_NEEDED: halogen-free status] | — |
| Embedded Memory Bits | — | 1,369,728 |
| Maximum User I/Os | — | 361 |
| LABs/CLBs | — | 1,694 |
| Maximum Operating Frequency | — | 732.1 MHz |
| Process Technology | — | 90 nm |
| Core Supply Voltage | — | 1.2 V |
| AEC-Q100 | — | Not applicable (FPGA, commercial/industrial) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |