EP2SGX60CF780C3N vs EP2SGX60DF780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60CF780C3N disebabkan oleh Intel dan EP2SGX60DF780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60CF780C3N | EP2SGX60DF780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Series | Stratix II GX | Stratix II |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 3,022 |
| User I/O Pins | 364 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Number of CLBs | 60,440 | — |
| Internal Frequency (max) | 816.9 MHz | ~717 MHz |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Lead-free / Compliant | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Family | — | Stratix II GX |
| Logic Elements / Cells | — | 60,440 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 1.2 V |
| Kemasan | — | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Jenis Pemasangan | — | Surface Mount |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |
| Speed Grade | — | C3 (fastest commercial) |