EP2SGX60CF780C3N vs EP2SGX60DF780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60CF780C3N sa pamamagitan ng Intel at EP2SGX60DF780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60CF780C3N | EP2SGX60DF780C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Series | Stratix II GX | Stratix II |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 3,022 |
| User I/O Pins | 364 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Number of CLBs | 60,440 | — |
| Internal Frequency (max) | 816.9 MHz | ~717 MHz |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Lead-free / Compliant | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Family | — | Stratix II GX |
| Logic Elements / Cells | — | 60,440 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Core Voltage | — | 1.2 V |
| Packhaging | — | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | — | Surface Mount |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |
| Speed Grade | — | C3 (fastest commercial) |