EP2SGX60DF780C3 vs EP2SGX60CF780C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C3 disebabkan oleh Intel dan EP2SGX60CF780C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60DF780C3 | EP2SGX60CF780C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Family | Stratix II GX | — |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | [DATA_NEEDED: number of transceivers] |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm |
| Internal Frequency (max) | ~717 MHz | — |
| Kemasan | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | C4 (commercial) |
| Status RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 3,022 |
| User I/O Count | — | 364 |
| Total Memory Bits | — | 2,544,192 |
| Internal Operating Frequency | — | up to 732.1 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | Flip-Chip Fine-Pitch BGA |
| Suhu Operasi | — | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] |