EP2SGX60DF780C3 vs EP2SGX60CF780C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3 sa pamamagitan ng Intel at EP2SGX60CF780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX60DF780C3 EP2SGX60CF780C4
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Family Stratix II GX —
Series Stratix II —
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 —
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 [DATA_NEEDED: number of transceivers]
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm
Internal Frequency (max) ~717 MHz —
Packhaging 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch)
Uri ng Pagpapasok Surface Mount Surface Mount
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) C4 (commercial)
Tindminan RoHS Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) [DATA_NEEDED: RoHS compliance]
Device Family — Stratix II GX
Logic Elements — 60,440
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 3,022
User I/O Count — 364
Total Memory Bits — 2,544,192
Internal Operating Frequency — up to 732.1 MHz
Propagation Delay — [DATA_NEEDED: propagation delay ns]
Core Supply Voltage — 1.2 V
Package Type — Flip-Chip Fine-Pitch BGA
Temperature na Operasyon — Commercial (0C to +85C) [DATA_NEEDED: exact TJ range]

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