EP2SGX60DF780C3 vs EP2SGX60CF780C4 比較

詳細並排比較 EP2SGX60DF780C3 由 Intel 與 EP2SGX60CF780C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX60DF780C3 EP2SGX60CF780C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Family Stratix II GX —
Series Stratix II —
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 —
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 [DATA_NEEDED: number of transceivers]
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm
Internal Frequency (max) ~717 MHz —
封裝 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch)
安裝類型 Surface Mount Surface Mount
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) C4 (commercial)
RoHS 狀態 Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) [DATA_NEEDED: RoHS compliance]
Device Family — Stratix II GX
Logic Elements — 60,440
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 3,022
User I/O Count — 364
Total Memory Bits — 2,544,192
Internal Operating Frequency — up to 732.1 MHz
Propagation Delay — [DATA_NEEDED: propagation delay ns]
Core Supply Voltage — 1.2 V
Package Type — Flip-Chip Fine-Pitch BGA
工作溫度 — Commercial (0C to +85C) [DATA_NEEDED: exact TJ range]

資料表與資源

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