EP2SGX60DF780C3 vs EP2SGX60DF780C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C3 disebabkan oleh Intel dan EP2SGX60DF780C5N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60DF780C3 | EP2SGX60DF780C5N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | 12 |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | 609.76 MHz |
| Kemasan | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | 5 (lower speed, higher Fmax margin) |
| Status RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: confirm RoHS compliance from manufacturer product page] |
| Logic Elements | — | 60,440 |
| Number of LABs/CLBs | — | 3,022 |
| Embedded Memory (bits) | — | 2,544,192 (≈2.5 Mb) |
| User I/O Count | — | 364 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 780-pin Flip-Chip BGA (FBGA-780) |
| Operating Temperature Grade | — | Commercial |
| Design Software | — | Quartus II |