EP2SGX60DF780C3 vs EP2SGX60DF780C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3 sa pamamagitan ng Intel at EP2SGX60DF780C5N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C3 | EP2SGX60DF780C5N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | — |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | 12 |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | 609.76 MHz |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | 5 (lower speed, higher Fmax margin) |
| Tindminan RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | [DATA_NEEDED: confirm RoHS compliance from manufacturer product page] |
| Logic Elements | — | 60,440 |
| Number of LABs/CLBs | — | 3,022 |
| Embedded Memory (bits) | — | 2,544,192 (≈2.5 Mb) |
| User I/O Count | — | 364 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 780-pin Flip-Chip BGA (FBGA-780) |
| Operating Temperature Grade | — | Commercial |
| Design Software | — | Quartus II |