EP2SGX60EF1152I3N vs EP2SGX60EF1152I5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I3N disebabkan oleh Intel dan EP2SGX60EF1152I5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60EF1152I3N | EP2SGX60EF1152I5 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | 1152 |
| Terminal Form | Ball | Ball |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Aras MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Embedded Memory (bits) | — | 2,544,192 |
| Frekuensi Klock Maksimum | — | 622.08 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Kemasan | — | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch |
| Package Code | — | BGA |
| Transceivers | — | Integrated multi-gigabit transceivers (per Stratix II GX family) |
| DSP Blocks | — | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) |