EP2SGX60EF1152I5 vs EP2SGX60EF1152I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I5 disebabkan oleh Intel dan EP2SGX60EF1152I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60EF1152I5 | EP2SGX60EF1152I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 | 60,440 |
| Embedded Memory (bits) | 2,544,192 | — |
| Frekuensi Klock Maksimum | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.15 V to 1.25 V | — |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) | — |
| Kemasan | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Terminal Form | Ball | Ball |
| Number of Terminals | 1152 | 1152 |
| Package Code | BGA | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Transceivers | Integrated multi-gigabit transceivers (per Stratix II GX family) | — |
| DSP Blocks | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) | — |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |