EP2SGX90EF1152C3ES vs EP2SGX90EF1152C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C3ES disebabkan oleh Intel dan EP2SGX90EF1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
EP2SGX90EF1152C3ES ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2SGX90EF1152C3ES | EP2SGX90EF1152C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix II GX | Stratix II GX |
| Process Node | 90 nm | — |
| Logic Elements | 90,960 | — |
| Embedded Memory | 4,520,448 bits (approx. 4.5 Mbit) | — |
| User I/O Pins | 558 | — |
| Kemasan | 1152-BBGA (FineLine BGA, 35x35 mm) | — |
| Speed Grade | C3 | EF |
| Temperature Grade | Commercial Extended (-40 C to +100 C) | C3 (Commercial) |
| Core Voltage | 1.5 V (Enhanced, 'E' suffix) | 1.2 V |
| High-Speed Transceivers | Up to 12 channels (per Stratix II GX family) | — |
| Transceiver Data Rate | Up to 6.375 Gbps per channel (family spec) | — |
| DSP Blocks | Yes, dedicated 18x18 multipliers and accumulators | — |
| PLL Count | [DATA_NEEDED: PLL count for EP2SGX90 variant] | — |
| User I/O Banks | 24 (per package datasheet) | — |
| Configuration | SRAM-based, supports Fast Passive Parallel, Fast Active Serial, JTAG | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Number of LABs/CLBs | — | 4548 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family] |
| Process Technology | — | 90 nm |
| Operating Frequency (max) | — | 816.9 MHz |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |